Our Capabilities
We have a range of capabilities to meet your PCB assembly and testing needs:
Surface Mount Technology (SMT)
Thru-Hole Technology (THT)
Double Side + Intrusive Reflow Process
Mixed Technology
BGA & micro-BGA Chip Scale Packaging
Full Turn Key – Kitted Assemblies
Fine Pitch Components
Soldering Types
Box Build
Flexible Turn Times
Advanced Inventory Management
Testing
